Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
Baosheng Wu, Honggang Dong, Peng Li, Yueting Ma, Yuesen Yang, Cunzhu Zou, Chao Li
Topics & Concepts
Materials scienceDiffusion bondingMicrostructureCopperAlloyTitanium alloyMetallurgyShear strength (soil)DiffusionTitaniumComposite materialThermodynamicsEnvironmental scienceSoil waterPhysicsSoil scienceAdvanced Welding Techniques AnalysisTitanium Alloys Microstructure and PropertiesAluminum Alloys Composites Properties