Microstructure and properties of silver-added W-Cu prepared by infiltration sintering
Dong–Guang Liu, Lin Meng, Jinxin Zou, Laima Luo, Yucheng Wu
Topics & Concepts
Materials scienceSinteringMicrostructureDiffractometerTungstenComposite materialComposite numberCopperRelative densityScanning electron microscopeVickers hardness testThermal conductivityElectrical resistivity and conductivityFracture toughnessMetallurgyElectrical engineeringEngineeringAdvanced materials and compositesMetal and Thin Film MechanicsFusion materials and technologies