Temperature-induced effect and control of Cu3Sn on the rotation of orientation-preferred Cu6Sn5 crystals at Sn-3.0Ag/(001)Cu interface
H.R. Ma, Chong Dong, Min Shang, Muhammad Muzammal Hussain, Y.P. Wang, X.G. Li, Haoran Ma, J. Chen
Topics & Concepts
Materials scienceIntermetallicRotation (mathematics)SolderingOrientation (vector space)NucleationTexture (cosmology)Crystal (programming language)Phase (matter)CrystallographyMelting pointComposite materialThermodynamicsGeometryComputer scienceAlloyProgramming languageArtificial intelligenceImage (mathematics)MathematicsChemistryPhysicsOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure Properties