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Effect of deposition potential on the microstructure and corrosion resistance of Ni–Cu alloys in ChCl-EG ionic liquids

Chongbo Zhan, Runjia Zhang, Xu Fu, Haijing Sun, Baojie Wang, Jie Sun

2023Journal of Applied Electrochemistry12 citationsDOI

Topics & Concepts

CorrosionPassivationMaterials scienceEutectic systemNucleationDielectric spectroscopyPlating (geology)Cyclic voltammetryChronoamperometryMetallurgyAlloyMicrostructureCoatingInorganic chemistryElectrochemistryChemical engineeringLayer (electronics)ChemistryElectrodeComposite materialPhysical chemistryGeophysicsGeologyEngineeringOrganic chemistryElectrodeposition and Electroless CoatingsIonic liquids properties and applicationsElectrochemical Analysis and Applications
Effect of deposition potential on the microstructure and corrosion resistance of Ni–Cu alloys in ChCl-EG ionic liquids | Litcius