Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In
Yuki Hirata, Chih-han Yang, Shih‐kang Lin, Hiroshi Nishikawa
Topics & Concepts
Materials scienceSolderingMicrostructureAlloyMetallurgyPhase (matter)ElongationBrittlenessPhase boundaryThermalUltimate tensile strengthChemistryThermodynamicsOrganic chemistryPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis