State of the Art of Cu–Cu Hybrid Bonding

John H. Lau

2024IEEE Transactions on Components Packaging and Manufacturing Technology41 citationsDOI

Abstract

In this study, the state of the art of Cu–Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges (opportunities), advantages and disadvantages, and examples of Cu–Cu bumpless HB. Also, some recommendations will be provided.

Topics & Concepts

State (computer science)Materials scienceCopperPolymer scienceComputer scienceMetallurgyProgramming language3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties