A Review on Conductive Polymer Composites Focusing on Advancements in Electrical Conductivity, and Electromagnetic Shielding Capabilities
M. G. VijayKashimatt, Manjunath Vatnalmath, V. Auradi
Abstract
ABSTRACT The exponential growth of modern electronic appliances inevitably triggered a substantial rise in electromagnetic interference (EMI), acknowledged as the fourth most pervasive form of pollution worldwide. Polymer composites (PCs) are recognized for their exceptional attributes, including lightweight construction, superior mechanical strength, corrosion resistance, and remarkable chemical stability, positioning them as promising candidates for EMI shielding applications. PCs demonstrating exceptional EMI shielding effectiveness (SE) can be used in cutting‐edge industrial sectors, particularly within the aerospace and defense domains. This review illuminates emerging materials based on polymer composites, further exploring the mechanisms governing EMI SE, thermal conductivity, and applications of EM bands within composite materials, different types of measurement techniques, factors influencing conductivity, various models for thermal and electrical study, strategies for the production of materials that are electrically insulating EMI SE, simulation softwares used, applications of polymer‐based EMI shielding materials, and applications of conductive PCs in electronic devices. It delves into a comprehensive analysis of the existing literature to date on 3D printed PCs for EMI shielding and electrical conductivity applications. The 3D printed multilayer PCs outperform the compression molded equivalents by 82% in SE while reducing the density by 20%–30%.