Evolution of interfacial voids in Cu-to-Cu joints
Hung-Che Liu, Shih‐Chi Yang, Jia-Juen Ong, Dinh-Phuc Tran, Andriy Gusak, K. N. Tu, Chih Chen
Topics & Concepts
Materials scienceComposite materialMetallurgy3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability