Influence of abrasive morphology and size dispersity of Cu barrier metal slurry on removal rates and wafer surface quality in chemical mechanical planarization
Seung-Chul Hong, Deoksu Han, Jangkuk Kwon, Sung Jun Kim, Seong Jae Lee, Keon‐Soo Jang
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceSlurryWaferAbrasiveSurface roughnessDispersityInterconnectionComposite materialSurface finishMorphology (biology)FabricationPolishingChemical engineeringMetallurgyNanotechnologyPolymer chemistryComputer networkMedicinePathologyEngineeringGeneticsAlternative medicineBiologyComputer scienceAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis