Copper Bonding Technology in Heterogeneous Integration
Yoon-Gu Lee, Michael J. McInerney, Young‐Chang Joo, In‐Suk Choi, Sarah Eunkyung Kim
Topics & Concepts
Materials scienceCopperStackingAnodic bondingThermocompression bondingWire bondingWafer bondingThree-dimensional integrated circuitWaferStack (abstract data type)Direct bondingOptoelectronicsEngineering physicsNanotechnologyMetallurgyIntegrated circuitComputer scienceLayer (electronics)ChipPhysicsTelecommunicationsEngineeringProgramming languageNuclear magnetic resonance3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability