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Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder

A.A. El-Daly, N. A. M. Eid, A.A. Ibrahiem

2022Journal of Alloys and Compounds23 citationsDOI

Topics & Concepts

CreepMaterials scienceAlloySolderingComposite materialComposite numberStress (linguistics)MetallurgyDislocationMicrostructureLinguisticsPhilosophyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties
Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder | Litcius