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Reliability of laser soldering using low melting temperature eutectic Sn Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad

Min-Seong Jeong, Dong-Hwan Lee, Hyeon Tae Kim, Jeong‐Won Yoon

2022Materials Characterization15 citationsDOI

Topics & Concepts

Materials scienceSolderingEutectic systemIntermetallicMetallurgyComposite materialShear strength (soil)Reflow solderingBrittlenessMicrostructureAlloySoil waterEnvironmental scienceSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdditive Manufacturing Materials and Processes
Reliability of laser soldering using low melting temperature eutectic Sn Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad | Litcius