Mechanism of interfacial thermal resistance variation in diamond/Cu/CNT tri-layer during thermal cycles
Xiaoyi Cai, Huaizuo Li, Jiaqing Zhang, Ting Ma, Qiuwang Wang
Topics & Concepts
Materials scienceThermalThermal resistanceMechanism (biology)DiamondInterfacial thermal resistanceLayer (electronics)Composite materialThermodynamicsEpistemologyPhilosophyPhysicsMetal and Thin Film MechanicsTribology and Wear AnalysisThermal properties of materials