Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
Cong Liu, Daquan Xia, Mizhe Tian, Shiqi Chen, Guisheng Gan, Yunfei Du, Xin Liu, Zhaoqi Jiang, Yiping Wu, Yanlong Ma
Topics & Concepts
Thermal shockMaterials scienceCrackingSolderingComposite materialMetallurgyParis' lawStructural engineeringFracture mechanicsEngineeringCrack closureHigh-Velocity Impact and Material BehaviorMicrostructure and Mechanical Properties of SteelsHigh Temperature Alloys and Creep