Microstructure and microwave dielectric properties of 3D printed low loss Bi2Mo2O9 ceramics for LTCC applications
Athanasios Goulas, George Chi‐Tangyie, Dawei Wang, Shiyu Zhang, Annapoorani Ketharam, Bala Vaidhyanathan, Ian M. Reaney, Darren A. Cadman, William G. Whittow, J.C. Vardaxoglou, Daniel S. Engstrøm
Topics & Concepts
Materials scienceCeramicSinteringRelative permittivityMicrostructureMicrowaveBismuthDielectricDielectric lossRelative densityComposite materialPermittivityOptoelectronicsMetallurgyTelecommunicationsComputer scienceMicrowave Dielectric Ceramics SynthesisFerroelectric and Piezoelectric MaterialsElectrical and Thermal Properties of Materials