Litcius/Paper detail

Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw

Zongqiang Li, Peiqi Ge, Wenbo Bi, Chengyun Li, Chao Wang, Jianfeng Meng

2021Materials Science in Semiconductor Processing27 citationsDOI

Topics & Concepts

WaferDiamondMaterials scienceSlicingSiliconAnisotropyCrystal (programming language)Monocrystalline siliconComposite materialOpticsOptoelectronicsMechanical engineeringComputer scienceEngineeringPhysicsProgramming languageAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research
Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw | Litcius