Surface Precipitation and Growth of Bismuth Particles in Sn-Ag-Cu-Bi Solder Joints
John A. Wu, Amey Luktuke, Nikhilesh Chawla
Topics & Concepts
BismuthNucleationSolderingPrecipitationMaterials scienceIdeal (ethics)DiffusionMetallurgyPhase (matter)ThermodynamicsChemistryPhilosophyOrganic chemistryEpistemologyMeteorologyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure Properties