Litcius/Paper detail

Evaluation of properties of sputtered Ni/Cu films with different thicknesses of the Cu layer

Salih Çölmekçi, Ali Karpuz, Hakan Köçkar

2021Thin Solid Films14 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceCoercivityLayer (electronics)CopperScanning electron microscopeAnalytical Chemistry (journal)Thin filmSputter depositionDiffractionSputteringCrystallizationComposite materialOpticsMetallurgyChemistryNanotechnologyCondensed matter physicsChromatographyPhysicsOrganic chemistryMagnetic properties of thin filmsMagnetic Properties and ApplicationsCopper Interconnects and Reliability
Evaluation of properties of sputtered Ni/Cu films with different thicknesses of the Cu layer | Litcius