Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices
Kangyong Li, Rong Zhang, Kai Yang, Hui Shen, Jialiang Chen, FanFan Wang, Jian Huang, Zexin Liu, Yue Yue, Zhiqiang Wang, Guoqing Xin
Topics & Concepts
Materials scienceHeat sinkMicrochannelThermal resistanceComposite materialThermal conductivityBrazingComposite numberHeat spreaderJunction temperatureThermalThermographyOperating temperatureThermal conductionPower densityHeat transferFabricationInfraredLeakage (economics)Interfacial thermal resistanceOptoelectronicsWork (physics)DiamondConvective heat transferHeat exchangerHeat pipeAnnealing (glass)Silicon carbidePower semiconductor deviceMachiningActive coolingThermal properties of materialsSilicon Carbide Semiconductor TechnologiesAdvanced ceramic materials synthesis