Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package
Chen Wang, Mingjun Qiu, Zongkun Pan, Kai‐Yi Zhou, Tao Wang, Jun Hong, Qiyin Lin
Topics & Concepts
Flip chipDissipationThermal management of electronic devices and systemsMaterials scienceChipChip-scale packageThermal copper pillar bumpPackage designElectronic packagingIntegrated circuit packagingMechanical engineeringElectronic engineeringEngineeringElectrical engineeringEngineering drawingComposite materialThermodynamicsLayer (electronics)AdhesivePhysicsAdhesion, Friction, and Surface InteractionsElectronic Packaging and Soldering Technologies3D IC and TSV technologies