Investigation on the microstructure, mechanical and electrical properties of Ti3SiC2/Cu joint obtained by Ti25Zr25Ni25Cu25 amorphous high entropy alloy and Ag composite filler
Xin Nai, Haiyan Chen, Shuai Zhao, Xiangwei Kong, Qian Wang, Pengcheng Wang, Wenya Li, Wenya Li
Topics & Concepts
BrazingMaterials scienceMicrostructureComposite numberComposite materialAlloyIntermetallicFOIL methodAmorphous solidFiller (materials)Joint (building)EngineeringArchitectural engineeringOrganic chemistryChemistryHigh Entropy Alloys StudiesMXene and MAX Phase MaterialsIntermetallics and Advanced Alloy Properties