Effect of internal stress on short-circuit diffusion in thin films and nanolaminates: Application to Cu/W nano-multilayers
A. V. Druzhinin, Bastian Rheingans, Sebastian Siol, Boris B. Straumal, Jolanta Janczak‐Rusch, Lars P. H. Jeurgens, Claudia Cancellieri
Topics & Concepts
Materials scienceGrain boundaryGrain boundary diffusion coefficientAnnealing (glass)Diffusion barrierDiffusionStress (linguistics)Activation energyEffective diffusion coefficientComposite materialThermodynamicsMicrostructurePhysical chemistryChemistryLayer (electronics)PhysicsRadiologyPhilosophyLinguisticsMedicineMagnetic resonance imagingCopper Interconnects and ReliabilityMicrostructure and mechanical propertiesMetal and Thin Film Mechanics