Bottom-up Cu filling of annular through silicon vias: Microstructure and texture
Sang‐Hyeok Kim, Hyo‐Jong Lee, D. Josell, Thomas P. Moffat
Topics & Concepts
MicrostructureTexture (cosmology)Materials scienceSiliconComposite materialMetallurgyComputer scienceArtificial intelligenceImage (mathematics)Electrodeposition and Electroless CoatingsCopper Interconnects and ReliabilitySemiconductor materials and interfaces