On the Issue of Crack Formation in a Thin Dielectric Layer on Silicon under Thermal Shock
А. А. Скворцов, M. V. Koryachko, Pavel A. Skvortsov, Mikhail N. Luk’yanov
Topics & Concepts
Materials scienceThermal shockComposite materialWaferSiliconDielectricCrackingLayer (electronics)Shock (circulatory)OxideOptoelectronicsMetallurgyInternal medicineMedicineAdvanced Surface Polishing TechniquesSilicon Nanostructures and PhotoluminescenceSilicon and Solar Cell Technologies