SiO2/SiC binary systems reinforced epoxy resins with high thermal conductivity and low CTE as underfill for 2.5D/3D electronic packaging
Yinghuan Zhao, Xiaoxin Lu, Jingke Wang, Binbin Qi, Zhengxun Hu, Yougen Hu, Guoxun Zeng, Zhiqiang Lin, Rong Sun
Topics & Concepts
EpoxyMaterials scienceComposite materialThermal conductivityFlip chipElectronic packagingConductivityThermalAdhesiveLayer (electronics)ChemistryPhysicsPhysical chemistryMeteorology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies