Layer-by-layer thinning of two-dimensional materials
Phuong V. Pham, The-Hung Mai, Huy‐Binh Do, М. Vasundhara, Van‐Huy Nguyen, Trieu Nguyen, Hao Van Bui, Van‐Duong Dao, Ram K. Gupta, Vinoth Kumar Ponnusamy, Jin‐Hong Park
Abstract
) based on conventional plasma-assisted thinning, integrated cyclic plasma-assisted thinning, laser-assisted thinning, metal-assisted splitting, and layer-resolved splitting are covered in detail, along with their mechanisms and benefits. Additionally, this review further explores the latest advancements in terms of the potential advantages of semiconductor devices achieved by top-down 2D material thinning procedures.
Topics & Concepts
ThinningLayer (electronics)Materials scienceChemistryComposite materialBiologyEcologyGraphene research and applicationsPhotonic Crystals and Applications2D Materials and Applications