High-performance surface acoustic wave devices using composite substrate structures
Shoji Kakio
Abstract
Abstract In this paper, first, the surface acoustic wave (SAW) propagation mode and a method of analyzing the propagation property are introduced briefly. Then, typical composite substrate structures that have been developed to obtain high-performance SAW devices are reviewed. Furthermore, the recent results obtained by the author and research colleagues on the propagation and resonance properties of leaky SAW (LSAW) and longitudinal-type LSAW on dissimilar-material bonded structures comprising a LiTaO 3 (LT) or LiNbO 3 thin plate with a thickness of less than 1 λ ( λ ː wavelength) and a quartz substrate are described. The control of attenuation and the cause of large coupling factor of LSAWs by utilizing layered structures were also discussed. For the bonded 4 inch wafer of 36°YX-LT/AT90°X-quartz with a thin-plate thickness of 0.3 λ , an admittance ratio of 81 dB, a fractional bandwidth of 4.2%, and resonance and antiresonance factors of approximately 1500 with markedly improved properties compared with a single 36°YX-LT substrate were obtained experimentally at 2.2 GHz.