Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives
Dongdong Liu, Zhenyu Zhang, Hongxiu Zhou, Xingqiao Deng, Chunjing Shi, Fanning Meng, Zhibin Yu, Junyuan Feng
Topics & Concepts
CopperPolishingTartaric acidSurface roughnessMaterials scienceX-ray photoelectron spectroscopyHydrogen peroxideComposite numberChemical-mechanical planarizationFourier transform infrared spectroscopyChemical engineeringSlurryScanning electron microscopeSurface finishComposite materialAnalytical Chemistry (journal)ChemistryMetallurgyOrganic chemistryEngineeringCitric acidAdvanced Surface Polishing TechniquesAdvanced materials and compositesDiamond and Carbon-based Materials Research