Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles

Wei Liu, Hung Wang, Kuo-Shuo Huang, Chang-Meng Wang, Albert T. Wu

2021Journal of the Taiwan Institute of Chemical Engineers36 citationsDOI

Topics & Concepts

Materials scienceNanoparticlePolyethylene glycolOxideChemical engineeringPEG ratioDecompositionThermal decompositionCopper oxideNanotechnologyComposite materialMetallurgyChemistryOrganic chemistryEconomicsEngineeringFinanceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties