Pressure-assisted sinter bonding method at 300 °C in air using a resin-free paste containing 1.5 μm Cu@Ag particles
Eun Byeol Choi, Jong‐Hyun Lee
Topics & Concepts
DewettingSinteringMaterials scienceSolventPolyolDie (integrated circuit)Chemical engineeringShear strength (soil)Composite materialMetallurgyNanotechnologyWettingChemistryPolyurethaneOrganic chemistrySoil scienceSoil waterEnvironmental scienceEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies