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Dislocation and deformation analysis of Cu-Ni thin films during Nano-indentation using molecular dynamics simulation approach

A. B. Shinde, Shivanjali Patil, Pooja Patil, Rohit Salunkhe, Rumana Sande, Sahil Pawar, Vijay Patil

2021Materials Today Proceedings15 citationsDOI

Topics & Concepts

Materials scienceIndentationDislocationRADIUSCopperIndentation hardnessComposite materialNanoindentationNickelCoatingDeformation (meteorology)Molecular dynamicsMetallurgyMicrostructureChemistryComputational chemistryComputer scienceComputer securityMetal and Thin Film MechanicsMicrostructure and mechanical propertiesAdvanced materials and composites
Dislocation and deformation analysis of Cu-Ni thin films during Nano-indentation using molecular dynamics simulation approach | Litcius