Understanding the mechanism of ultrasonic vibration-assisted drilling (UVAD) for micro-hole formation on silicon wafers using numerical and analytical techniques
Rendi Kurniawan, Shuo Chen, Moran Xu, Hanwei Teng, Jielin Chen, Saood Ali, Pil-Wan Han, Gandjar Kiswanto, S. Thirumalai Kumaran, Tae Jo Ko
Topics & Concepts
WaferMechanism (biology)VibrationMechanical engineeringMaterials scienceUltrasonic sensorDrillingSiliconProcess engineeringPetroleum engineeringEngineeringAcousticsNanotechnologyMetallurgyPhysicsQuantum mechanicsAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesAdvanced machining processes and optimization