Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging
Gangli Yang, Xiaoyan Li, Xu Han, Zhang Hu, Linjie Wen, Shanshan Li
Topics & Concepts
IntermetallicSolderingMaterials scienceMicrostructureJoint (building)Intergranular fractureBrittlenessShear strength (soil)Composite materialFracture (geology)Intergranular corrosionBrittle fractureMetallurgyDiffusionStructural engineeringSoil waterAlloyThermodynamicsEnvironmental scienceEngineeringPhysicsSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties