An artificial intelligence transformation model – pod redesign of photomasks in semiconductor manufacturing
Shu‐Kai S. Fan, Ming-Shen Chen, Chia‐Yu Hsu, You‐Jin Park
Abstract
This paper proposes a new enterprise intelligentization framework, by making the transition from process transformation to artificial intelligence (AI) transformation. The novel transformation framework can be decomposed into the conceptual model of AI strategic planning, the procedural model, the operational model, and the analytics model. For leading-edge microchip production, a new AI transformation project regarding the reticle SMIF pod (RSP) transport system designed by a medium-sized semiconductor tool vendor in Taiwan is presented. The technical advantages, gained from the implementation of the presented AI transformation project, over the existing RSP systems are manifold. The throughput and yield rate significantly increase on a semiconductor-fabrication-plant basis. The clean room construction costs less by approximately 3 million dollars per FAB, mainly attributed to the redesigned automatic optical inspection flow. The proposed model-based framework proves to be a viable tool from the process transformation to the AI transformation in the semiconductor manufacturing.