Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading
N R E Lim, Aristotle T. Ubando, Jeremias A. Gonzaga, Richard Dimagiba
Topics & Concepts
Ball grid arrayDie (integrated circuit)Fracture mechanicsFinite element methodMaterials scienceStructural engineeringIntegrated circuit packagingComposite materialMechanical engineeringEngineeringIntegrated circuitSolderingOptoelectronicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise Suppression