Effect of interface structure on advanced bonding between tungsten-based materials and Cu alloys: a review
Yuanyuan Chen, Zhang Liu, Sai Ramudu Meka, Yuan Huang, Zumin Wang
Topics & Concepts
TungstenMaterials scienceInterface (matter)MetallurgyComposite materialWettingSessile drop techniqueAdvanced materials and compositesAdvanced ceramic materials synthesis3D IC and TSV technologies