Interfacial voids and microstructure evolution, bonding behavior and deformation mechanism of TC4 diffusion bonded joints
Peng Yu, Jinglong Li, Zhaoxi Li, Shiwei Li, Wei Guo, Xiangyu Gao, Jiangtao Xiong
Topics & Concepts
Materials scienceGrain boundaryComposite materialVoid (composites)Microstructurevon Mises yield criterionSlip (aerodynamics)PlasticityFinite element methodStructural engineeringThermodynamicsPhysicsEngineeringAdvanced Welding Techniques AnalysisMicrostructure and mechanical propertiesMetal Forming Simulation Techniques