High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles
Yang Zuo, Sadie Carter‐Searjeant, Mark Green, Liam Mills, S.H. Mannan
Topics & Concepts
SinteringMaterials scienceNanoparticleOxideIn situShear strength (soil)Composite materialConsolidation (business)MetallurgyNanotechnologyMeteorologyEnvironmental scienceSoil waterBusinessAccountingSoil sciencePhysicsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologiesnanoparticles nucleation surface interactions