Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Katsuaki Suganuma
Topics & Concepts
EpoxyCopperX-ray photoelectron spectroscopyRaman spectroscopyMaterials scienceComposite materialSubstrate (aquarium)Layer (electronics)Wire bondingAnalytical Chemistry (journal)Chemical engineeringChemistryMetallurgyOpticsChipOrganic chemistryTelecommunicationsComputer scienceOceanographyEngineeringGeologyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability