Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
Vance Liu, Yung-Sheng Zou, Yiyu Chen, Wan Ling Chang, Xue Qin Foo, Yijing Chen, Chien-Ming Chen, Min-Hua Chung, Chong Leong Gan
Topics & Concepts
Materials scienceSolderingReliability (semiconductor)Joint (building)Lead (geology)Characterization (materials science)Shear strength (soil)MetallurgyMobile deviceReliability engineeringComputer scienceStructural engineeringNanotechnologyEngineeringGeomorphologySoil waterPhysicsQuantum mechanicsSoil scienceOperating systemGeologyEnvironmental sciencePower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties