Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints
Min-Seong Jeong, Dong-Hwan Lee, Jeong‐Won Yoon
Topics & Concepts
SolderingMaterials scienceMetallurgyComposite materialShear (geology)MicroelectronicsFracture (geology)Joint (building)MicrostructureShear forceFracture mechanicsShear strength (soil)Direct shear testStructural engineeringSoil waterEnvironmental scienceOptoelectronicsEngineeringSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis