Litcius/Paper detail

In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis

Quan Zhou, Tae-Kyu Lee, Thomas R. Bieler

2020Materials Science and Engineering A20 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceElectron backscatter diffractionBall grid arraySolderingMicrostructureTemperature cyclingComposite materialThermalMetallurgyThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties
In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis | Litcius