Mechanism on the nucleation of orientation-preferred Cu6Sn5 at different temperatures and solder compositions
Chong Dong, Min Shang, Haoran Ma, Yunpeng Wang, Xiaogan Li, Haitao Ma
Topics & Concepts
NucleationSolderingMaterials scienceSubstrate (aquarium)Enhanced Data Rates for GSM EvolutionMetallurgyCrystallographyComposite materialChemistryGeologyOrganic chemistryTelecommunicationsOceanographyComputer scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies