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Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn–3.0Ag–0.5Cu(SAC305)/Cu–2.0Be solder joints during reflowing

Zuozhu Yin, Mei Lin, Qi Li, Ziyuan Wu

2020Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

SolderingMaterials scienceIntermetallicMicrostructureShear strength (soil)MetallurgyComposite materialWettingSubstrate (aquarium)Layer (electronics)NanoparticleAlloyNanotechnologyGeologySoil waterSoil scienceOceanographyEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties
Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn–3.0Ag–0.5Cu(SAC305)/Cu–2.0Be solder joints during reflowing | Litcius