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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

T.T. Dele‐Afolabi, M. A. Azmah Hanim, K. Vidyatharran, Khamirul Amin Matori, O. Saliza Azlina, R. Calin

2022Journal of Materials Science Materials in Electronics14 citationsDOI

Topics & Concepts

MicrostructureSolderingMaterials scienceComposite materialComposite numberShear strength (soil)Substrate (aquarium)Surface finishShear (geology)Reflow solderingDirect shear testMetallurgyEnvironmental scienceSoil waterGeologySoil scienceOceanographyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies
Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish | Litcius