The influence of ceramic powder modification temperature on copper-based composite materials: A perspective on mechanical and frictional behavior
Jiaqi Wu, Zhuan Li, Zonglong Gao, Guoyuan Wen, Ye Li
Abstract
To enhance the bonding capability of composite ceramic powder and subsequently improve the friction stability of copper-based composite materials, B 4 C-SiC ceramic powder modified at different temperatures was used. The results indicate that elevating the modification temperature of ceramic powder promotes faster growth of particles and enhances inter-particle bonding. The mechanical properties of the copper-based composite material are significantly improved, particularly at 1400 °C, owing to the filling of pores and the particle reinforcement effect of ceramic. Meanwhile, the friction coefficient and wear exhibit a gradual increase, mainly caused by the formation of microasperities from larger ceramic particles and sepiolite, leading to changes in the friction-film and friction mechanism. The primary wear mechanism shifts from abrasive wear (1200 °C-1300 °C-1400 °C) to oxidative wear (1500 °C).