Litcius/Paper detail

Non-contact Post-CMP megasonic cleaning of cobalt wafers

Lifei Zhang, Xinchun Lu, Ahmed Busnaina

2022Materials Science in Semiconductor Processing20 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationMaterials scienceWaferLayer (electronics)NanoparticleCobaltChemical engineeringVolumetric flow rateAdsorptionWet cleaningNanotechnologyDiffusionOptoelectronicsComposite materialMetallurgyChemistryOrganic chemistryThermodynamicsPhysicsEngineeringQuantum mechanicsAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesMicrofluidic and Bio-sensing Technologies
Non-contact Post-CMP megasonic cleaning of cobalt wafers | Litcius