Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering
Chunming Wang, Luming Zeng, Wucheng Ding, Tongxiang Liang
Topics & Concepts
SinteringMaterials scienceMetallurgyFabricationCopperAlloyCopper platingGold plating (software engineering)Electroless platingPlating (geology)Copper alloyComposite materialElectroplatingComputer scienceSoftware engineeringGeophysicsGeologyAlternative medicinePathologyMedicineLayer (electronics)Titanium Alloys Microstructure and PropertiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties