A mild recycling of flame-retarding bisphenol-A epoxy towards formaldehyde-free wood adhesive by introducing hydrazone/ester dual reversible bonds
Weijun Yang, Lianhua Chen, Ning Ding, Débora Puglia, Pengwu Xu, Deyu Niu, Xinli Zhu, Piming Ma
Topics & Concepts
EpoxyFormaldehydeAdhesiveHydrazoneBisphenol AMaterials scienceEpoxy adhesiveComposite materialPolymer chemistryBisphenolChemical engineeringChemistryOrganic chemistryEngineeringLayer (electronics)Polymer composites and self-healingLignin and Wood ChemistryPhotopolymerization techniques and applications