Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry
Juhwan Kim, Donggeon Kwak, Jungjae Park, Takayuki Kubota, Taesung Kim
Topics & Concepts
Hydrogen peroxideOxidizing agentSlurryDecompositionChemical-mechanical planarizationMaterials scienceInorganic chemistryMetalPeroxideOxygenChemistryChemical engineeringOrganic chemistryMetallurgyComposite materialPolishingEngineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques